Dispensing Equipment
Dymax manual and automated fluid dispense systems and spray valves are easily integrated into existing manufacturing processes for easy application of coatings, lubricants, or masking resins.
Appliance Subcomponent Assembly
Light-Curable Materials for Appliance Subcomponent Assembly
Bond glass, metal, and plastics often found in appliance subcomponent assembly using Dymax light-curable coatings, gaskets, and maskants. for less work in progress and increased throughput. All Dymax materials cure using LED/UV/Visible light, are one-component, and have no solvents added which helps reduce work in progress, increase throughput, and eliminate waste.
Dymax LCMs are ideal for the assembly of appliances, power tools, alignment devices, speakers, motors, magnets, as well as circuit boards. Applications include vibration isolation and reduction, touchscreen positioning, display mounting and sealing, potting isolated chips, conformal coating of PCBs, wire tacking, bonding windings, and masking during polishing and finishing.
Typical applications:
- Circuitry
- Control panels
- Windows
- Subcomponent bodies
- Electrical components
Features
- Rapid cure using LED/UV/Visible light
- One part materials - no mixing
- No solvents added
- Increase throughput & efficiency
Product Number
Product Description
Regional Availability
3094-T-REV-A
Low-stress, low shrinkage plastic bonding adhesive cures with high-intensity UV/Visible light in seconds for rapid bonding and sealing of a variety of plastics. The adhesive is thixotropic and jet friendly for easy dispensing.
6-630-T
Glass-to-metal bonding adhesive cures within seconds using UV/Visible light, pre-applied activator, or secondary heat cure. This product features excellent flexibility and is high-temperature and moisture resistant.
Product Number
Product Description
Regional Availability
501-E-REV-A
501-E-REV-A Activator, when pre-applied to metallic, plated, ceramic, or glass substrates rapidly cures 600 series and 800 series structural adhesives and thermal interface materials in gaps from less than 1 mil to 20 mils.
GA-142
Flexible FIP/CIP gasketing resin for applications that require soft, tacky, flexible, low compression set. This silicone-free product cures upon exposure to UV/Visible light.
921-T
High-strength resin for rigid adhesive bonds or potting of a wide variety of substrates. This resin cures clear and deep. This product can be cured with UV light, and shadow areas can be cured with heat.
3099
Fast-curing adhesive designed to form strong bonds to PMMA (Acrylic), polycarbonate, glass, and other plastic substrates. This product's clarity and low viscosity produce clear, bubble-free bond lines.
3069
Rapidly bond and laminate flexible and rigid substrates including a variety of plastics. The bond strength of this product on PC and PVC usually exceeds the strength of the substrates being assembled.
846-GEL
High-performance structural bonding adhesive ideal for bonding dissimilar substrates where maximum tensile shear strength is required. This product cures using activator.
GA-103
Form-in-place gasket sealant has excellent moisture- and chemical resistance for high-temperature sealing applications and underwater enclosures that require a low compression set. This silicone-free gasket has a self-leveling viscosity and cures with UV/Visible light in seconds.
GA-120
Self-leveling FIP gasket with good deflection is formulated for applications such as speaker assembly and automotive enclosures, which require a soft, tacky, flexible gasket.
GA-142-F
Soft, tacky, flexible FIP/CIP gasketing resin with good adhesion to plastic, metal, and ceramic surfaces. This product cures upon exposure to UV/Visible light and fluoresces blue for easy visual inspection.
9-911-REV-B
UV/Visible light-curable adhesive for rapid tacking of repair wires on PCBs. This product has high tensile strength, excellent adhesion, and faster UV fixture time. This adhesive features a secondary heat cure for complete cures in shadow areas.
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