Telecom electronics demand adhesives and coatings that ensure reliability in high-density, high-speed applications. Dymax light-curable materials are designed for bonding optical modules and protecting PCB assemblies under thermal, mechanical, and environmental stress. These materials offer precise placement, fast curing, and long-term performance—helping telecom manufacturers meet throughput goals while maintaining signal integrity and durability.
Key Product Capabilities Include:
Applications include optical module assembly, fiber-optic bonding, PCB encapsulation and coating, wire and chip protection, and reinforcement of electronics in telecom applications.