SpeedMask®

9-20479-B-REV-A

Blue PCB Protective Maskant


SpeedMask® 9-20479-B-REV-A is a blue maskant that cures upon exposure to UV/Visible light for rapid masking of electronic components and assemblies. The product is easily removable, eliminating the concern of ionic contamination or silicone left behind by other methods. Typical applications include masking for conformal coating applications as well as masking for wave solder and reflow processes.

The material is halogen-free and has no solvents added This peelable mask protects keep-out areas during conformal coating applications and is compatible with gold and copper pins. 9-20479-B-REV-A is exceptionally thixotropic for manual or automated dispensing on boards or components that may be difficult to mask with other methods.

Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.

SpeedMask® 9-20479-B-REV-A is in full compliance with the RoHS Directives 2015/863/EU.
 

Features

  • Cures with UV/Visible light
  • Compatible with gold and copper connector pins
  • Exceptionally thixotropic for manual or automated dispensing
  • No solvents added
  • Halogen free
  • Silcone free

Typical Properties

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Property Values
Viscosity (nominal) 115,000 cP
Uncured appearance Blue transparent gel
Recommended substrates Lead frame; Ceramic; PCB; Flex; Silicon

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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Peelable Electronic Maskants

Dymax peelable maskants for electronics cure in seconds when exposed to UV/Visible light. The products are all one part, solvent free, and silicone free. The formulations are highly thixotropic for manual or automated dispensing onto difficult components prior to conformal coating applications, wave soldering, or reflow operations. After full cure, the masks peel off cleanly.

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