SpeedMask®

9-318-F

Peelable Mask for Electronic Applications


SpeedMask® 9-318-F cures in seconds when exposed to UV/Visible light. This removable material is designed for rapid masking of electronic components and assemblies to protect from reflow or wave soldering operations. The maskant also shields keep-out areas during conformal coating applications. The product is highly thixotropic for manual or automated dispensing on boards or components that may be difficult to mask with other methods. It has no solvents added and is silicone-free.

9-318-F also fluoresces blue for blacklight inspection. Cured masks are easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods.

Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.

This maskant is in full compliance with the RoHS2 Directives 2015/863/EU.

Features

  • Cures with UV/Visible light
  • Fluoresces blue for easy inspection
  • Highly thixotropic for manual or automated dispensing onto difficult components
  • Halogen free
  • Very low VOCs
  • Silicone free
  • Medium adhesion for peeling
  • No solvents added
  • Compliant with RoHS2 directives 2015/863/EU

Typical Properties

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Property Values
Viscosity (nominal) 50,000 cP
Uncured appearance Translucent yellow
Recommended substrates Lead frame; Ceramic; PCB; Flex; Silicon

Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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Peelable Electronic Maskants

Dymax peelable maskants for electronics cure in seconds when exposed to UV/Visible light. The products are all one part, solvent free, and silicone free. The formulations are highly thixotropic for manual or automated dispensing onto difficult components prior to conformal coating applications, wave soldering, or reflow operations. After full cure, the masks peel off cleanly.

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